Flexible Chips: A Catalyst for Realizing the Internet of Everything (IoE)

While an already well-established market, the Internet of Things (IoT) is set to soar to new heights, reaching a $12.5 trillion valuation by 2030, as predicted by McKinsey. However, the vision of an Internet of Everything (IoE) – comprised of billions of smart, connected devices that deliver insights and efficiencies at scale – has yet to come to fruition.

What is really hindering the progress of the IoE? Could a new kind of thin-film, flexible chip pave the way for a more intelligent and interconnected future?

What’s holding back the full realization of the IoE? 

Ubiquitous connectivity requires an abundant and consistent supply of semiconductors, yet current manufacturing techniques struggle to meet the volume required for billions of smart objects. IoE items tend to use ‘legacy’ chips rather than state-of-the-art chips, but despite the name, they are not outdated technology. These chips are routinely adjusted for new applications and requirements, extending into all reaches of technology.

The importance of legacy chips in our global economy was brought into focus during the pandemic. As demand outpaced supply, we witnessed assembly lines grind to a halt, and a wide range of devices – from ovens to cars – were left unshipped. Due to this disruption, it’s clear now more than ever that our modern lives rely heavily on these chips, but bottlenecks continue to impact the supply chain.

So, if the supply of chips is what’s holding back the IoE, why not produce more?  

Growing legacy chip production is no easy task. In fact, many chips are manufactured in fabrication plants (fabs) that rely on older equipment, which can be harder to source. Additionally, constructing a new fab is time-consuming and expensive, often taking tens of billions of dollars to build and needing two or more years to be fully operational.  

Another challenge is sustainability. While newer fabs are designed for maximum efficiency, with modern wastewater management systems and a strong focus on reducing energy use, many older fabs were constructed at a time when reducing carbon emissions wasn’t a key priority.

The long development timelines and high costs involved in chip manufacturing are another key factor to consider. The demand for connectivity calls for a low-cost solution that can be quickly scaled.

It’s clear that current chip production techniques are not suited to the realization of an IoE. Therefore, we must explore alternative processes and innovative materials to enable sustainable, widespread connectivity.

Building the Internet of Everything (IoE)

New, advanced material semiconductors – combined with innovative fabrication methods – are revolutionizing the industry and finally putting an IoE within reach. Flexible integrated circuits based on thin-film technology don’t require the complex, high-temperature processes inherent in silicon chip fabrication. Instead, they use a simple spin-coating technique, where polyimide is applied to a glass carrier. This allows fabrication at much lower temperatures, which significantly reduces the use of energy, water, and harmful chemicals. In turn, this slashes carbon emissions while also cutting down on set-up costs and production timelines.

Using this method, flexible chips can be produced in just four weeks. This speed opens new possibilities for innovation: designers no longer need to get it ‘right first time’, as the rapid cycle times enable on-the-fly design adjustments, and iterative improvements as requirements change. Furthermore, with reduced non-recurring engineering costs, the barriers to entry are significantly lowered, making it more financially viable to bring new designs to life.

Global connectivity unleashed

So how does this impact the IoE?

The ultra-low cost and reduced carbon footprint of flexible chips position them as ideal candidates to embed into everyday objects. These qualities make them perfectly suited for IoE applications, where they can generate vast amounts of data to fuel AI models, enabling greater efficiency and actionable insights at scale.

In the fast-moving consumer goods (FMCG) sector, this connectivity could facilitate item-level product verification or one-tap consumer interactions, creating more personalized experiences. In healthcare, the flexibility of these chips is particularly valuable for wearable patches, offering a simple yet effective solution for monitoring wounds or detecting heart anomalies, for example. Moreover, they could play a crucial role in advancing the circular economy by enabling scalable tracking of reusable packaging at item level or improving recycling accuracy at the end of a product’s life.  

We are on the brink of an IoE revolution, but to fully realize it, we must be able to deploy item-level intelligence at scale. Flexible chips are the key to unlocking this, paving the way for the vision of the IoE to become a reality.